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Rochester Electronics LTC1421CSW-2.5#PBF

HOT SWAP CONTROLLER
part number has RoHS
Manufacturer # :LTC1421CSW-2.5#PBF
Manufacturer :Rochester Electronics
Dasenic # :LTC1421CSW-2.5#PBF-DS
Customer # :
Description : HOT SWAP CONTROLLER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 63.1473$ 63.15
25+$ 61.8903$ 1547.26
100+$ 59.3762$ 5937.62
500+$ 56.8622$ 28431.1
1000+$ 53.6826$ 53682.6
In Stock: 1532
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 63.1473
Total :$ 63.15
Delivery :
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Payment :
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  • Rochester Electronics LTC1421CSW-2.5#PBF technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Hot Swap Controllers
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Features:Latched Fault, UVLO
  • Mounting Type:Surface Mount
  • Package / Case:24-SOIC (0.295", 7.50mm Width)
  • Current - Supply:1.5 mA
  • Type:Hot Swap Controller
  • Number of Channels:2
  • Supplier Device Package:24-SOIC
  • Internal Switch(s):No
  • Voltage - Supply:3V ~ 12V
  • Programmable Features:Circuit Breaker, Fault Timeout, Slew Rate
  • Current - Output ( Max):-
  • Applications:General Purpose
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LTC1421CSW-2.5#PBF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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