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Rochester Electronics RMPA2266

IC POWER 2 CIRCUIT 11LCC
part number has RoHS
Manufacturer # :RMPA2266
Manufacturer :Rochester Electronics
Dasenic # :RMPA2266-DS
Customer # :
Description : IC POWER 2 CIRCUIT 11LCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.6143$ 0.61
25+$ 0.6020$ 15.05
100+$ 0.5774$ 57.74
500+$ 0.5529$ 276.45
1000+$ 0.5222$ 522.2
In Stock: 28800
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6143
Total :$ 0.61
Delivery :
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Payment :
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  • Rochester Electronics RMPA2266 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Amplifiers - Instrumentation, OP Amps, Buffer Amps
  • Product Status:Active
  • Operating Temperature:-30°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:10-LDFN Exposed Pad
  • Current - Supply:25mA
  • Output Type:-
  • Supplier Device Package:11-LCC (4x4)
  • Number of Circuits:2
  • Amplifier Type:Power
  • -3db Bandwidth:-
  • Current - Output / Channel:-
  • Slew Rate:-
  • Gain Bandwidth Product:-
  • Current - Input Bias:-
  • Voltage - Input Offset:-
  • Voltage - Supply Span ( Min):3 V
  • Voltage - Supply Span ( Max):4.2 V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
RMPA2266 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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