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Onsemi 1N5230B_T50A

DIODE ZENER 4.7V 500MW DO35
part number has RoHS
Manufacturer # :1N5230B_T50A
Manufacturer :Onsemi
Dasenic # :1N5230B_T50A-DS
Customer # :
Description : DIODE ZENER 4.7V 500MW DO35
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 53
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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  • Onsemi 1N5230B_T50A technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Zener - Single
  • Product Status:Obsolete
  • Tolerance:±5%
  • Operating Temperature:-65°C ~ 200°C
  • Mounting Type:Through Hole
  • Package / Case:DO-204AH, DO-35, Axial
  • Power - Max:500 mW
  • Supplier Device Package:DO-35
  • Voltage - Forward ( Vf) ( Max) @ If:1.2 V @ 200 mA
  • Current - Reverse Leakage @ Vr:2 µA @ 1 V
  • Voltage - Zener ( Nom) ( Vz):4.7 V
  • Impedance ( Max) ( Zzt):19 Ohms
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.10.0050
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
1N5230B_T50A provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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