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Bourns 1.5SMBJ17CA

DIO TVS VRWM 17V 1500W BIDIR SMB
part number has RoHS
Manufacturer # :1.5SMBJ17CA
Manufacturer :Bourns
Dasenic # :1.5SMBJ17CA-DS
Customer # :
Description : DIO TVS VRWM 17V 1500W BIDIR SMB DO-214AA, SMB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 1.4040$ 14.04
12000+$ 0.7020$ 8424
120000+$ 0.6660$ 79920
600000+$ 0.6320$ 379200
In Stock: 980
MOQ :1 PCS
Packaging :DO-214AA, SMB
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.404
Total :$ 1.40
Delivery :
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Payment :
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  • Bourns 1.5SMBJ17CA technical specifications, attributes, parameters.
  • Category:Circuit Protection Devices/TVS - Diodes
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:DO-214AA, SMB
  • Type:Zener
  • Capacitance @ Frequency:-
  • Supplier Device Package:SMB (DO-214AA)
  • Unidirectional Channels:-
  • Voltage - Reverse Standoff ( Typ):17V
  • Voltage - Breakdown ( Min):18.9V
  • Voltage - Clamping ( Max) @ Ipp:27.6V
  • Current - Peak Pulse (10/1000µs):54.4A
  • Power - Peak Pulse:1500W (1.5kW)
  • Power Line Protection:No
  • Bidirectional Channels:1
  • Applications:General Purpose
1.5SMBJ17CA provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments. Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A. One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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